Color Ultrasonic Diagnostic Apparatus : DW-T3

Sub-array technology
The dedicated high-density probe adopts a brand-new array design technology and a unique sub-array element technology. The second cutting of independent wafers can completely control the entire process of wafer vibration, thereby reducing side lobe artifacts and enhancing the fine resolution of tissues. The boundary between adjacent strong echo reflectors is sharper. It fully demonstrates the high-resolution images brought by the high-density probe, perfectly presents the image details, and increases the accuracy of clinical diagnosis.